LNOI Wafer for High-Speed Modulator, RF Filter & Photonic Integrated Circuits

LNOI wafers combine the excellent electro-optic properties of lithium niobate with advanced thin-film fabrication technology, enabling high-performance integrated photonics, RF communication, and quantum devices.

Tổng quan về sản phẩm

Lithium Niobate on Insulator (LNOI) wafers are advanced thin-film photonic materials fabricated by bonding a high-quality LiNbO₃ single crystal layer onto an insulating substrate (such as Si or SiO₂).

LNOI Wafer for High-Speed Modulator, RF Filter & Photonic Integrated Circuits

By combining ion implantation + wafer bonding + smart-cut technology, LNOI enables ultra-thin lithium niobate films with excellent optical and electrical performance.

It is widely used in:

  • High-speed electro-optic modulators
  • RF acoustic wave filters (SAW/BAW)
  • Integrated photonics circuits
  • Quantum optical devices
  • High-frequency communication systems

Những ưu điểm nổi bật 

1. High-Speed & Low Power Optical Performance

  • Ultra-high bandwidth electro-optic modulation
  • High transmission rate
  • Low driving voltage
  • Small device footprint → supports photonic integration

2. RF & 5G Communication Advantages

  • High electromechanical coupling coefficient (Ke² > 25%)
  • Wide bandwidth acoustic wave response
  • Excellent high-frequency performance
  • Suitable for next-generation 5G/6G RF filters

3. Excellent Stability & Reliability

  • Strong temperature stability
  • High chemical resistance (acid & alkali resistant)
  • Stable operation under harsh environments
  • High heat dissipation capability

4. Superior Material Properties of LiNbO₃

  • Strong electro-optic (Pockels) effect
  • Excellent piezoelectric properties
  • Nonlinear optical performance
  • High compatibility with integrated photonics

Công nghệ sản xuất

LNOI wafers are produced using Smart-Cut + Wafer Bonding Process:

  1. He ion implantation
    • Helium ions implanted into LiNbO₃ crystal
    • Creates controlled weak cleavage layer
  2. Wafer bonding

    • Bonded to Si or SiO₂ substrate under high temperature & pressure
  3. Thermal annealing
    • Defect evolution and layer separation
    • Forms high-quality thin film LiNbO₃ layer
  4. Surface finishing
    • Polishing and thinning to required nanometer-micrometer thickness

Typical Specifications

Item Thông số kỹ thuật
Wafer Size 150 mm ±0.2 mm
Film Thickness 350 nm – few µm (customizable)
Orientation X-cut / Y-cut ±0.2°
Surface Roughness Ra ≤ 0.5 nm (AFM RMS)
TTV < 70 µm (150 mm wafer)
Độ phẳng < 1.3 µm
Sự minh bạch >95% (450–700 nm)
Curie Temperature 1142 ±1°C

Ứng dụng

 1. Integrated Photonics

  • Optical modulators
  • Waveguides
  • Resonators
  • On-chip photonic circuits

 2. Telecom & Data Center

  • High-speed fiber communication
  • Optical signal modulation
  • Data center interconnect (DCI)

 3. RF & Wireless Communication

  • SAW/BAW RF filters
  • 5G/6G high-frequency devices
  • Low-loss RF components

 4. Quantum & Advanced Optics

  • Entangled photon generation
  • Quantum communication systems
  • Nonlinear optics devices

5. Sensors & MEMS

  • Pressure sensors
  • Acceleration sensors
  • Acoustic and vibration devices

Why LNOI Matters

Compared with traditional bulk lithium niobate:

  • Smaller device size
  • Higher bandwidth
  • Easier photonic integration
  • Lower power consumption
  • CMOS-compatible platform potential

 It is a key material for next-generation photonics + RF convergence technology.

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