The Electric Fused Quartz Ingot is a high-purity fused quartz material produced by electric fusion technology. It is designed for applications requiring low hydroxyl content, high chemical purity, excellent thermal stability, and reliable performance in high-temperature environments.
This material is commonly supplied as a quartz ingot, cylinder, ring blank, or machined quartz blank. It can be further processed into quartz windows, rings, discs, plates, flanges, viewports, semiconductor quartz parts, and customized precision components.
With low metallic impurity levels, good dimensional stability, and strong resistance to thermal stress, electric fused quartz ingots are widely used in semiconductor diffusion, annealing, etching, microelectronics, aerospace, optics, laser systems, and other high-end technical fields.
Fő jellemzők
High Purity Fused Quartz Material
The material has controlled metallic impurity content and is suitable for demanding thermal, optical, and semiconductor-related applications.
Low Hydroxyl Content
Low OH content helps improve material stability during high-temperature use, especially in processes involving repeated heating cycles.
Excellent High Temperature Resistance
Electric fused quartz provides strong resistance to elevated temperatures and maintains good structural stability under proper operating conditions.
Good Optical and Thermal Stability
The material offers reliable thermal behavior, low thermal expansion, and good optical consistency, making it suitable for precision optical and industrial components.
Suitable for Precision Machining
Quartz ingots can be cut, ground, polished, drilled, and machined into customized quartz components according to drawings or samples.
Standard Product Information
| Tétel | Specifikáció |
|---|---|
| Termék neve | Electric Fused Quartz Ingot |
| Anyag | High-purity electric fused quartz |
| Product Forms | Quartz ingot, quartz cylinder, quartz ring blank, quartz block, custom quartz blank |
| Appearance | Translucent to semi-transparent fused quartz |
| Production Process | Electric fusion |
| Processing Methods | Cutting, grinding, polishing, drilling, CNC machining, fire polishing |
| Customization | Diameter, height, thickness, flatness, surface finish, holes, grooves, steps, and special shapes |
| Alkalmazási területek | Semiconductor, microelectronics, optics, laser, aerospace, high-temperature equipment |
Typical Chemical Purity
| Element | High Purity Grade | Enhanced Low-Impurity Grade |
|---|---|---|
| Al | 8 ppm | 0.1 ppm |
| Li | 0.5 ppm | 0.4 ppm |
| B | 0.1 ppm | 0.1 ppm |
| Na | 0.6 ppm | 0.09 ppm |
| Mg | 0.1 ppm | 0.01 ppm |
| K | 0.5 ppm | 0.03 ppm |
| Ca | 0.6 ppm | 0.45 ppm |
| Ti | 0.1 ppm | 0.08 ppm |
| Fe | 0.35 ppm | 0.2 ppm |
| Co | 0 ppm | 0 ppm |
| Ni | 0.1 ppm | 0.1 ppm |
| Mn | 0.05 ppm | 0.03 ppm |
| Cu | 0.5 ppm | 0.01 ppm |
| OH | 15 ppm | 10 ppm |
The values above are typical reference data. Actual impurity levels may vary by batch and can be confirmed by inspection report or material certificate when required.
Typical Physical Properties
| Category | Ingatlan | Tipikus érték |
|---|---|---|
| Mechanical Properties | Sűrűség | Approx. 2.2 g/cm³ |
| Mechanical Properties | Mohs keménység | 6-7 |
| Mechanical Properties | Poisson’s Ratio | Approx. 0.17 |
| Mechanical Properties | Szakítószilárdság | Approx. 4.9 × 10⁷ Pa |
| Mechanical Properties | Nyomószilárdság | ＞1,1 × 10⁹ Pa |
| Mechanical Properties | Hajlítószilárdság | Approx. 65–95 MPa |
| Mechanical Properties | Csavarószilárdság | Approx. 30 MPa |
| Elektromos tulajdonságok | Dielektromos állandó | Approx. 3.74 |
| Elektromos tulajdonságok | Loss Factor | ＜1 × 10⁻³ |
| Elektromos tulajdonságok | Ellenállás 20°C-on | Approx. 1 × 10¹⁶ Ω·m |
| Termikus tulajdonságok | Coefficient of Thermal Expansion | Approx. 5.2–5.8 × 10⁻⁷/K |
| Termikus tulajdonságok | Specific Heat at 20°C | Approx. 749 J/kg·K |
| Termikus tulajdonságok | Thermal Conductivity at 20°C | Approx. 1.38 W/m·K |
| Termikus tulajdonságok | Strain Point | Approx. 1070°C |
| Termikus tulajdonságok | Izzítási pont | Approx. 1150°C |
| Termikus tulajdonságok | Lágyulási pont | Approx. 1670°C |
These values are typical reference properties of fused quartz. Actual performance depends on size, machining condition, surface finish, thermal history, and operating environment.
Main Applications
| Application Area | Tipikus használat |
|---|---|
| Félvezető feldolgozás | Quartz parts for diffusion, annealing, etching, and thermal processing |
| Microelectronics | High-purity quartz components for precision process environments |
| Optical Industry | Quartz windows, plates, lenses, discs, and optical support parts |
| Lézer rendszerek | Heat-resistant and optically stable quartz components |
| Repülőgépipar | High-temperature quartz parts and precision insulating components |
| Laboratóriumi berendezések | Viewports, reaction parts, and high-temperature observation components |
| Precision Machining | Raw material for quartz rings, flanges, cylinders, blocks, and custom parts |
Product Advantages
The Electric Fused Quartz Ingot is suitable for customers requiring high-purity quartz material with low hydroxyl content and strong high-temperature performance. Its low impurity profile helps reduce contamination risk in sensitive thermal and optical applications.
Compared with ordinary quartz material, electric fused quartz offers better consistency for precision machining and high-temperature use. It can be processed into a wide range of customized quartz parts, including rings, windows, discs, plates, blocks, flanges, viewports, and complex machined quartz components.
For semiconductor applications, final material selection should consider impurity limits, OH content, surface finish, cleaning method, packaging requirements, and actual process environment.
Custom Processing Options
| Custom Item | Available Options |
|---|---|
| Shape Customization | Ingot, cylinder, ring blank, block, disc, plate, window, flange, special shape |
| Dimensional Processing | Diameter, height, thickness, inner hole, groove, step, chamfer, flatness |
| Felületkezelés | Ground surface, polished surface, frosted surface, fire-polished surface |
| Machining Method | Cutting, drilling, grinding, polishing, CNC machining, thermal processing |
| Drawing Support | OEM fabrication according to drawings or samples |
| Inspection Support | Dimensional inspection, visual inspection, impurity data, OH content, material certificate |
Quality Control
| Inspection Item | Leírás |
|---|---|
| Appearance Inspection | Check visible bubbles, inclusions, cracks, chips, scratches, and surface defects |
| Dimensional Inspection | Diameter, height, thickness, inner diameter, flatness, and tolerance control |
| Material Verification | Chemical impurity data and OH content can be confirmed when required |
| Processing Inspection | Surface finish, edge quality, hole position, groove structure, and special machining details |
| Packaging Inspection | Protective packaging according to product size, surface condition, and cleanliness requirements |
GYIK
1. What is an electric fused quartz ingot?
An electric fused quartz ingot is a high-purity quartz material produced by electric fusion. It is usually supplied as an ingot, cylinder, ring blank, or block and can be further machined into precision quartz components.
2. What are the main advantages of electric fused quartz?
Its main advantages include high purity, low hydroxyl content, excellent high-temperature resistance, low thermal expansion, good electrical insulation, and suitability for precision machining.
3. What applications is this material suitable for?
It is suitable for semiconductor diffusion, annealing, etching, optical components, laser systems, microelectronics, aerospace parts, laboratory equipment, and customized quartz components.
4. Can it be machined into custom quartz parts?
Yes. It can be processed into quartz rings, windows, discs, plates, flanges, cylinders, blocks, viewports, and special-shaped quartz parts according to drawings or samples.
5. Is this material suitable for semiconductor processes?
Yes, it can be used for semiconductor-related quartz components. For contamination-sensitive wafer processes, impurity level, OH content, surface condition, cleaning method, and packaging standard should be confirmed before selection.
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