Aperçu du produit

The 2-inch quartz wafer is a semiconductor-grade substrate made from high-purity silicon dioxide (SiO₂). It achieves micron-level flatness through precision processing techniques such as CNC cutting and laser polishing. These wafers comply with SEMI standards and support customization in dimensions and thickness (±0.02 mm tolerance), making them suitable for optoelectronics, MEMS (Micro-Electro-Mechanical Systems), and semiconductor packaging.

Fuyao provides customized production for non-standard geometries, including freeform shapes, graded thickness, and advanced surface treatments such as Anti-Reflective (AR) coatings and hydrophobic films. Full-process quality control ensures total thickness variation (TTV) <0.005 mm and surface roughness Ra <1.5 nm. Small-batch prototyping (minimum 10 units) and rapid delivery options are available for time-sensitive projects.

Spécifications

Paramètres	Spécifications
Diamètre	2 inch (50.8 mm)
Thickness Range	0.1 mm – 1.0 mm
Material Purity	≥99.99%
Surface Roughness (Ra)	≤5 nm
Total Thickness Variation	≤10 μm
Transmittance (@193 nm)	>90%
Coefficient of Thermal Expansion	~0.55×10⁻⁶/°C
Point d'adoucissement	~1665°C
Emballage	100-Level Cleanroom

1 Optical Excellence

• Broad-Spectrum Transmittance: >90% in the ultraviolet range (185–3500 nm), with superior short-wave UV performance (185 nm).

• Low Thermal Expansion: CTE ~0.52×10⁻⁶/°C (5–35°C), can withstand long-term temperatures up to 1100°C and short-term exposure to 1450°C.

2 Mechanical and Chemical Stability

• High Strength: Flexural strength 2–3× higher than standard glass, Mohs hardness 7.

• Corrosion Resistance: 30× higher acid resistance than ceramics, suitable for harsh chemical environments.

3 Electrical Insulation

• Resistivity exceeding 10¹⁸ Ω·cm with low dielectric loss at high frequencies, ideal for RF circuits and sensors.

Applications primaires

1 Semiconductor Manufacturing

• Substrates for CMOS image sensors and RFID chip packaging, supporting wafer-level packaging (WLP) for higher integration.

• MEMS device substrates (e.g., pressure sensors, accelerometers) ensuring structural stability for micro-components.

2 Optoelectronic Systems

• UV laser windows and fiber-optic communication couplers, leveraging excellent UV transmission.

• Aerospace optical windows resistant to radiation and thermal cycling.

3 Medical and Research

• High-temperature optical components for endoscopic imaging systems.

• Heat-resistant observation windows for laboratory reactors.

4 Specialized Quartz Window Plates

• Freeform surfaces, asymmetric apertures, graded thickness.

• Angled-cut windows to minimize reflection losses.

• Through-hole windows for multi-sensor integration.

• Rapid prototyping: 3–5 days for samples, <500-unit small batches, optional vacuum coatings (AR or reflective coatings) for research and military applications.

FAQ

1 Why choose 2-inch quartz wafers ?
2-inch quartz wafers are semiconductor-grade substrates made from high-purity silicon dioxide (SiO₂). They achieve micron-level flatness using precision CNC cutting and laser polishing. These wafers support customization in dimensions and thickness (±0.02 mm) and comply with SEMI standards, making them ideal for optoelectronics, MEMS, and semiconductor packaging.

2 What are the primary applications of 2-inch quartz wafers ?
They are primarily used in semiconductor manufacturing (CMOS image sensors, RFID chip packaging), UV laser windows, fiber-optic communication couplers, and aerospace optical components. Custom surface treatments such as Anti-Reflective coatings enhance performance in high-precision systems.