{"id":2811,"date":"2026-04-28T09:31:12","date_gmt":"2026-04-28T09:31:12","guid":{"rendered":"https:\/\/www.fuyao-quartz.com\/?post_type=product&p=2811"},"modified":"2026-04-28T09:31:19","modified_gmt":"2026-04-28T09:31:19","slug":"sapphire-through-glass-via-tgv-substrate-for-mems-sensors-and-advanced-semiconductor-packaging","status":"publish","type":"product","link":"https:\/\/www.fuyao-quartz.com\/vi\/product\/sapphire-through-glass-via-tgv-substrate-for-mems-sensors-and-advanced-semiconductor-packaging\/","title":{"rendered":"Sapphire qua l\u1edbp k\u00ednh tr\u00ean n\u1ec1n TGV d\u00e0nh cho MEMS, c\u1ea3m bi\u1ebfn v\u00e0 \u0111\u00f3ng g\u00f3i b\u00e1n d\u1eabn ti\u00ean ti\u1ebfn"},"content":{"rendered":"
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\"SapphireThe Sapphire Through Glass Via (TGV) Substrate is a high-precision microfabricated interposer designed for advanced semiconductor packaging, MEMS devices, and sensor integration. Built on premium Sapphire (Al\u2082O\u2083 single crystal)<\/span><\/span> substrates, this technology enables vertical electrical interconnections through ultra-hard, optically transparent, and chemically stable materials.<\/p>\n

Compared to traditional silicon or glass interposers, sapphire-based TGV substrates offer superior mechanical strength, higher thermal stability, and enhanced reliability in harsh environments. These advantages make them particularly suitable for high-frequency, high-density, and high-reliability applications such as RF devices, optical sensors, and advanced packaging architectures (2.5D\/3D integration).<\/p>\n

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Key Features & Advantages<\/h2>\n

1. High-Density Vertical Interconnection<\/h3>\n

TGV technology enables compact and efficient vertical electrical pathways through sapphire substrates, supporting high-density integration required in modern semiconductor packaging and miniaturized devices.<\/p>\n

2. Superior Mechanical Strength<\/h3>\n

Sapphire\u2019s high hardness (Mohs 9) ensures excellent structural integrity, making the substrate resistant to cracking, warping, and mechanical damage during processing and operation.<\/p>\n

3. Excellent High-Frequency Performance<\/h3>\n

With low dielectric loss, minimal parasitic capacitance, and reduced inductance, sapphire TGV substrates are ideal for RF, 5G, and high-speed signal transmission applications.<\/p>\n

4. Outstanding Thermal Stability<\/h3>\n

Sapphire maintains excellent performance under extreme temperatures, making it suitable for high-power and thermally demanding environments.<\/p>\n

5. Chemical Resistance and Hermeticity<\/h3>\n

The material is highly resistant to acids, alkalis, and corrosive environments. TGV structures can also achieve excellent hermetic sealing performance, ensuring long-term reliability.<\/p>\n

6. Optical Transparency<\/h3>\n

Unlike silicon interposers, sapphire substrates offer optical transparency across UV\u2013IR ranges, enabling integration with optical sensors, photonics, and imaging systems.<\/p>\n

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Technical Specifications<\/h2>\n
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\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
Parameter<\/th>\nSpecification<\/th>\n<\/tr>\n<\/thead>\n
Product Name<\/td>\nSapphire TGV Substrate<\/td>\n<\/tr>\n
Material<\/td>\nSingle-crystal Sapphire (Al\u2082O\u2083)<\/td>\n<\/tr>\n
Wafer Size<\/td>\nUp to 300 mm<\/td>\n<\/tr>\n
Panel Size<\/td>\nUp to 515 \u00d7 515 mm<\/td>\n<\/tr>\n
Thickness<\/td>\n0.1 \u2013 0.7 mm (customizable)<\/td>\n<\/tr>\n
Min. Thickness<\/td>\n0.3 mm<\/td>\n<\/tr>\n
Via Diameter (OD)<\/td>\n25 \u2013 100 \u03bcm<\/td>\n<\/tr>\n
Min. Pitch<\/td>\n~2 \u00d7 via diameter<\/td>\n<\/tr>\n
Via Type<\/td>\nThrough \/ Blind<\/td>\n<\/tr>\n
Via Shape<\/td>\nStraight<\/td>\n<\/tr>\n
Aspect Ratio<\/td>\nUp to 1:5<\/td>\n<\/tr>\n
Via Material<\/td>\nTungsten (W) \/ Silicon (Si)<\/td>\n<\/tr>\n
Hermeticity<\/td>\n\u2264 1\u00d710\u207b\u2079 Pa\u00b7m\u00b3\/s<\/td>\n<\/tr>\n
Tolerance<\/td>\n\u00b120 \u03bcm (per 200 mm wafer)<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
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\"SapphireManufacturing Process<\/h2>\n

Sapphire TGV substrates are fabricated using advanced laser-induced modification combined with chemical etching<\/strong>:<\/p>\n

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  1. Laser Structuring<\/strong> \u2013 A precision laser modifies the internal structure of sapphire in predefined via regions<\/li>\n
  2. Selective Etching<\/strong> \u2013 Modified regions are etched at faster rates, forming clean, high-aspect-ratio vias<\/li>\n
  3. Metallization<\/strong> \u2013 Vias are filled with conductive materials such as tungsten or silicon<\/li>\n
  4. Optional Processes<\/strong> \u2013 Including cavity formation, bumping, and surface metallization<\/li>\n<\/ol>\n

    This process ensures:<\/p>\n

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    • Crack-free via formation<\/li>\n
    • High dimensional accuracy<\/li>\n
    • Smooth via sidewalls<\/li>\n
    • Compatibility with high-density designs<\/li>\n<\/ul>\n
      \n

      Applications<\/h2>\n

      Semiconductor Packaging<\/h3>\n
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      • 2.5D \/ 3D interposers<\/li>\n
      • Wafer-level chip scale packaging (WL-CSP)<\/li>\n
      • High-density interconnects<\/li>\n<\/ul>\n

        MEMS & Sensors<\/h3>\n
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        • Pressure sensors<\/li>\n
        • Optical sensors<\/li>\n
        • Microfluidic devices<\/li>\n<\/ul>\n

          RF & 5G Devices<\/h3>\n
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          • High-frequency modules<\/li>\n
          • Low-loss signal transmission systems<\/li>\n<\/ul>\n

            Photonics & Optical Integration<\/h3>\n
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            • Optical interposers<\/li>\n
            • Imaging systems<\/li>\n
            • Transparent sensor packaging<\/li>\n<\/ul>\n

              High-Performance Computing & IoT<\/h3>\n
                \n
              • High-bandwidth data transmission<\/li>\n
              • Compact and high-density integration<\/li>\n<\/ul>\n
                \n

                Customization Capabilities<\/h2>\n

                \"Sapphire<\/p>\n

                We provide fully customizable sapphire TGV solutions<\/strong> tailored to your application requirements:<\/p>\n

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                • Via diameter, pitch, and density optimization<\/li>\n
                • Wafer or panel-level customization<\/li>\n
                • Through or blind via design<\/li>\n
                • Metallization (W, Cu, or custom materials)<\/li>\n
                • Surface finishing and polishing<\/li>\n
                • Integration with bonding processes (e.g., anodic bonding)<\/li>\n
                • High-precision tolerance control<\/li>\n<\/ul>\n
                  \n

                  FAQ<\/h2>\n

                  Q1: What is the advantage of sapphire TGV over glass or silicon TGV?<\/strong>
                  A1: Sapphire offers higher mechanical strength, better thermal stability, and optical transparency, making it more suitable for harsh environments and optical-integrated applications.<\/p>\n

                  Q2: Can via size and pitch be customized?<\/strong>
                  A2: Yes. Via diameter, pitch, and layout can be fully customized according to your design requirements.<\/p>\n

                  Q3: Is sapphire TGV suitable for high-frequency applications?<\/strong>
                  A3: Absolutely. Its low dielectric loss and excellent electrical properties make it ideal for RF, 5G, and high-speed signal transmission systems.<\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n

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                  <\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n
                  <\/div>\n","protected":false},"excerpt":{"rendered":"

                  C\u00e1c ch\u1ea5t n\u1ec1n TGV b\u1eb1ng sapphire \u0111\u1ea1i di\u1ec7n cho th\u1ebf h\u1ec7 c\u00f4ng ngh\u1ec7 k\u1ebft n\u1ed1i ti\u00ean ti\u1ebfn ti\u1ebfp theo, k\u1ebft h\u1ee3p c\u00e1c \u0111\u1eb7c t\u00ednh v\u1eadt li\u1ec7u v\u01b0\u1ee3t tr\u1ed9i c\u1ee7a sapphire v\u1edbi c\u00e1c k\u1ef9 thu\u1eadt ch\u1ebf t\u1ea1o vi m\u00f4 hi\u1ec7n \u0111\u1ea1i nh\u1ea5t. Ch\u00fang cung c\u1ea5p m\u1ed9t n\u1ec1n t\u1ea3ng \u0111\u00e1ng tin c\u1eady cho c\u00e1c h\u1ec7 th\u1ed1ng \u0111i\u1ec7n t\u1eed v\u00e0 quang t\u1eed t\u1ea7n s\u1ed1 cao, m\u1eadt \u0111\u1ed9 cao v\u00e0 hi\u1ec7u su\u1ea5t cao. V\u1edbi kh\u1ea3 n\u0103ng t\u00f9y ch\u1ec9nh linh ho\u1ea1t v\u01b0\u1ee3t tr\u1ed9i, c\u00e1c gi\u1ea3i ph\u00e1p TGV b\u1eb1ng sapphire l\u00e0 l\u1ef1a ch\u1ecdn l\u00fd t\u01b0\u1edfng cho c\u00e1c \u1ee9ng d\u1ee5ng b\u00e1n d\u1eabn v\u00e0 c\u1ea3m bi\u1ebfn th\u1ebf h\u1ec7 m\u1edbi.<\/p>","protected":false},"featured_media":2816,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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