{"id":2811,"date":"2026-04-28T09:31:12","date_gmt":"2026-04-28T09:31:12","guid":{"rendered":"https:\/\/www.fuyao-quartz.com\/?post_type=product&p=2811"},"modified":"2026-04-28T09:31:19","modified_gmt":"2026-04-28T09:31:19","slug":"sapphire-through-glass-via-tgv-substrate-for-mems-sensors-and-advanced-semiconductor-packaging","status":"publish","type":"product","link":"https:\/\/www.fuyao-quartz.com\/tr\/product\/sapphire-through-glass-via-tgv-substrate-for-mems-sensors-and-advanced-semiconductor-packaging\/","title":{"rendered":"MEMS, Sens\u00f6rler ve Geli\u015fmi\u015f Yar\u0131 \u0130letken Paketleme i\u00e7in TGV Substrat \u00dczerinden Safir Cam"},"content":{"rendered":"
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\"SapphireThe Sapphire Through Glass Via (TGV) Substrate is a high-precision microfabricated interposer designed for advanced semiconductor packaging, MEMS devices, and sensor integration. Built on premium Sapphire (Al\u2082O\u2083 single crystal)<\/span><\/span> substrates, this technology enables vertical electrical interconnections through ultra-hard, optically transparent, and chemically stable materials.<\/p>\n

Compared to traditional silicon or glass interposers, sapphire-based TGV substrates offer superior mechanical strength, higher thermal stability, and enhanced reliability in harsh environments. These advantages make them particularly suitable for high-frequency, high-density, and high-reliability applications such as RF devices, optical sensors, and advanced packaging architectures (2.5D\/3D integration).<\/p>\n

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Key Features & Advantages<\/h2>\n

1. High-Density Vertical Interconnection<\/h3>\n

TGV technology enables compact and efficient vertical electrical pathways through sapphire substrates, supporting high-density integration required in modern semiconductor packaging and miniaturized devices.<\/p>\n

2. Superior Mechanical Strength<\/h3>\n

Sapphire\u2019s high hardness (Mohs 9) ensures excellent structural integrity, making the substrate resistant to cracking, warping, and mechanical damage during processing and operation.<\/p>\n

3. Excellent High-Frequency Performance<\/h3>\n

With low dielectric loss, minimal parasitic capacitance, and reduced inductance, sapphire TGV substrates are ideal for RF, 5G, and high-speed signal transmission applications.<\/p>\n

4. Outstanding Thermal Stability<\/h3>\n

Sapphire maintains excellent performance under extreme temperatures, making it suitable for high-power and thermally demanding environments.<\/p>\n

5. Chemical Resistance and Hermeticity<\/h3>\n

The material is highly resistant to acids, alkalis, and corrosive environments. TGV structures can also achieve excellent hermetic sealing performance, ensuring long-term reliability.<\/p>\n

6. Optical Transparency<\/h3>\n

Unlike silicon interposers, sapphire substrates offer optical transparency across UV\u2013IR ranges, enabling integration with optical sensors, photonics, and imaging systems.<\/p>\n

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Technical Specifications<\/h2>\n
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\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
Parameter<\/th>\nSpecification<\/th>\n<\/tr>\n<\/thead>\n
Product Name<\/td>\nSapphire TGV Substrate<\/td>\n<\/tr>\n
Material<\/td>\nSingle-crystal Sapphire (Al\u2082O\u2083)<\/td>\n<\/tr>\n
Wafer Size<\/td>\nUp to 300 mm<\/td>\n<\/tr>\n
Panel Size<\/td>\nUp to 515 \u00d7 515 mm<\/td>\n<\/tr>\n
Thickness<\/td>\n0.1 \u2013 0.7 mm (customizable)<\/td>\n<\/tr>\n
Min. Thickness<\/td>\n0.3 mm<\/td>\n<\/tr>\n
Via Diameter (OD)<\/td>\n25 \u2013 100 \u03bcm<\/td>\n<\/tr>\n
Min. Pitch<\/td>\n~2 \u00d7 via diameter<\/td>\n<\/tr>\n
Via Type<\/td>\nThrough \/ Blind<\/td>\n<\/tr>\n
Via Shape<\/td>\nStraight<\/td>\n<\/tr>\n
Aspect Ratio<\/td>\nUp to 1:5<\/td>\n<\/tr>\n
Via Material<\/td>\nTungsten (W) \/ Silicon (Si)<\/td>\n<\/tr>\n
Hermeticity<\/td>\n\u2264 1\u00d710\u207b\u2079 Pa\u00b7m\u00b3\/s<\/td>\n<\/tr>\n
Tolerance<\/td>\n\u00b120 \u03bcm (per 200 mm wafer)<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
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\"SapphireManufacturing Process<\/h2>\n

Sapphire TGV substrates are fabricated using advanced laser-induced modification combined with chemical etching<\/strong>:<\/p>\n

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  1. Laser Structuring<\/strong> \u2013 A precision laser modifies the internal structure of sapphire in predefined via regions<\/li>\n
  2. Selective Etching<\/strong> \u2013 Modified regions are etched at faster rates, forming clean, high-aspect-ratio vias<\/li>\n
  3. Metallization<\/strong> \u2013 Vias are filled with conductive materials such as tungsten or silicon<\/li>\n
  4. Optional Processes<\/strong> \u2013 Including cavity formation, bumping, and surface metallization<\/li>\n<\/ol>\n

    This process ensures:<\/p>\n

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    • Crack-free via formation<\/li>\n
    • High dimensional accuracy<\/li>\n
    • Smooth via sidewalls<\/li>\n
    • Compatibility with high-density designs<\/li>\n<\/ul>\n
      \n

      Applications<\/h2>\n

      Semiconductor Packaging<\/h3>\n
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      • 2.5D \/ 3D interposers<\/li>\n
      • Wafer-level chip scale packaging (WL-CSP)<\/li>\n
      • High-density interconnects<\/li>\n<\/ul>\n

        MEMS & Sensors<\/h3>\n
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        • Pressure sensors<\/li>\n
        • Optical sensors<\/li>\n
        • Microfluidic devices<\/li>\n<\/ul>\n

          RF & 5G Devices<\/h3>\n
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          • High-frequency modules<\/li>\n
          • Low-loss signal transmission systems<\/li>\n<\/ul>\n

            Photonics & Optical Integration<\/h3>\n
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            • Optical interposers<\/li>\n
            • Imaging systems<\/li>\n
            • Transparent sensor packaging<\/li>\n<\/ul>\n

              High-Performance Computing & IoT<\/h3>\n
                \n
              • High-bandwidth data transmission<\/li>\n
              • Compact and high-density integration<\/li>\n<\/ul>\n
                \n

                Customization Capabilities<\/h2>\n

                \"Sapphire<\/p>\n

                We provide fully customizable sapphire TGV solutions<\/strong> tailored to your application requirements:<\/p>\n

                  \n
                • Via diameter, pitch, and density optimization<\/li>\n
                • Wafer or panel-level customization<\/li>\n
                • Through or blind via design<\/li>\n
                • Metallization (W, Cu, or custom materials)<\/li>\n
                • Surface finishing and polishing<\/li>\n
                • Integration with bonding processes (e.g., anodic bonding)<\/li>\n
                • High-precision tolerance control<\/li>\n<\/ul>\n
                  \n

                  FAQ<\/h2>\n

                  Q1: What is the advantage of sapphire TGV over glass or silicon TGV?<\/strong>
                  A1: Sapphire offers higher mechanical strength, better thermal stability, and optical transparency, making it more suitable for harsh environments and optical-integrated applications.<\/p>\n

                  Q2: Can via size and pitch be customized?<\/strong>
                  A2: Yes. Via diameter, pitch, and layout can be fully customized according to your design requirements.<\/p>\n

                  Q3: Is sapphire TGV suitable for high-frequency applications?<\/strong>
                  A3: Absolutely. Its low dielectric loss and excellent electrical properties make it ideal for RF, 5G, and high-speed signal transmission systems.<\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n

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                  <\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n
                  <\/div>\n","protected":false},"excerpt":{"rendered":"

                  Safir TGV alt tabakalar\u0131, safirin ola\u011fan\u00fcst\u00fc malzeme \u00f6zelliklerini en son mikrofabrikasyon teknikleriyle birle\u015ftiren yeni nesil geli\u015fmi\u015f ara ba\u011flant\u0131 teknolojisini temsil etmektedir. Y\u00fcksek frekansl\u0131, y\u00fcksek yo\u011funluklu ve y\u00fcksek performansl\u0131 elektronik ve fotonik sistemler i\u00e7in g\u00fcvenilir bir platform sa\u011flarlar. M\u00fckemmel \u00f6zelle\u015ftirme esnekli\u011fi ile safir TGV \u00e7\u00f6z\u00fcmleri, yeni nesil yar\u0131 iletken ve sens\u00f6r uygulamalar\u0131 i\u00e7in idealdir.<\/p>","protected":false},"featured_media":2816,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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