แผ่นซิลิคอนคาร์ไบด์ (SiC) ชนิด 6H-N ขนาด 2 นิ้ว – วัสดุฐานผลึกเดี่ยว 350μm / 650μm

FUYAO QUARTZ provides high-quality 2-inch 6H-N silicon carbide (SiC) wafers, designed as reliable substrates for advanced semiconductor and power electronic devices. Silicon carbide is a wide-bandgap semiconductor material known for its superior electrical, thermal, and mechanical properties compared with conventional silicon.

แผ่นซิลิคอนคาร์ไบด์ (sic) ขนาด 2 นิ้ว หนา 6h – วัสดุฐานผลึกเดี่ยว 350μm / 650μmFUYAO QUARTZ provides high-quality 2-inch 6H-N silicon carbide (SiC) wafers, designed as reliable substrates for advanced semiconductor and power electronic devices. Silicon carbide is a wide-bandgap semiconductor material known for its superior electrical, thermal, and mechanical properties compared with conventional silicon.

The 6H-N SiC polytype offers excellent electrical conductivity, high thermal stability, and strong resistance to harsh environments, making it suitable for power electronics, high-temperature devices, and research applications.

These wafers are manufactured with high crystal quality and low defect density, ensuring stable device fabrication performance and long-term reliability in demanding semiconductor environments.

คุณสมบัติเด่น

High Electrical Conductivity
The N-type conductive structure provides stable carrier transport and is suitable for power electronic device fabrication.

Wide Bandgap Semiconductorแผ่นซิลิคอนคาร์ไบด์ (sic) ขนาด 2 นิ้ว หนา 6h – วัสดุฐานผลึกเดี่ยว 350μm / 650μm
With a bandgap of approximately 3.02 eV, SiC enables operation under high voltage, high temperature, and high-frequency conditions.

High Thermal Conductivity
SiC efficiently dissipates heat generated by high-power devices, improving reliability and device lifetime.

Excellent Mechanical Strength
With a Mohs hardness around 9.2, SiC wafers exhibit strong mechanical durability and wear resistance.

High Breakdown Electric Field
SiC supports high-voltage device structures thanks to its high breakdown field strength.

Technical Specifications

พารามิเตอร์ ข้อกำหนด
วัสดุ Single Crystal Silicon Carbide
Polytype 6H-N
เส้นผ่านศูนย์กลาง 2 inch (50.8 mm)
ความหนา 350 μm or 650 μm
ผิวสำเร็จ CMP Polished Si-face
C-face Treatment Mechanical Polish
Surface Roughness Ra < 0.2 nm (Si-face)
Resistivity 0.015 – 0.028 Ω·cm
Color Transparent / Light Green
Packaging Single Wafer Container

Material Properties of 6H-SiC

ทรัพย์สิน 6H-SiC Value
Lattice Parameters a = 3.073 Å, c = 15.117 Å
ความแข็งโมห์ส ≈ 9.2
ความหนาแน่น 3.21 g/cm³
สัมประสิทธิ์การขยายตัวทางความร้อน 4–5 ×10⁻⁶ /K
Refractive Index (750 nm) n₀ = 2.60, nₑ = 2.65
Dielectric Constant ≈ 9.66
การนำความร้อน ~3.7–3.9 W/cm·K
Bandgap 3.02 eV
Breakdown Electric Field 3–5 ×10⁶ V/cm
Saturation Drift Velocity 2.0 ×10⁵ m/s

การประยุกต์ใช้

แผ่นซิลิคอนคาร์ไบด์ (sic) ขนาด 2 นิ้ว หนา 6h – วัสดุฐานผลึกเดี่ยว 350μm / 650μmPower Electronics
Used for high-power and high-voltage semiconductor devices such as diodes, MOSFETs, and power modules.

High-Temperature Electronics
Suitable for devices operating in harsh environments such as aerospace and energy systems.

Research and Semiconductor Development
Widely used as a substrate material for semiconductor research and device prototyping.

Optoelectronic Devices
Applicable in certain optical and photonic applications due to its optical transparency and high refractive index.

คำถามที่พบบ่อย

Q1: What is the difference between 6H-SiC and 4H-SiC wafers?
A: Both 6H-SiC and 4H-SiC are polytypes of silicon carbide with different crystal structures and electrical properties. 4H-SiC typically offers higher electron mobility and is widely used for modern power devices, while 6H-SiC provides stable conductivity and excellent thermal properties, making it suitable for certain power electronics, optoelectronic devices, and research applications.

Q2: What surface finish is provided for the SiC wafer?
A: The silicon face (Si-face) of the wafer is processed with chemical mechanical polishing (CMP) to achieve an ultra-smooth surface with roughness Ra < 0.2 nm, while the carbon face (C-face) is typically mechanically polished. This surface quality ensures compatibility with semiconductor fabrication processes and epitaxial growth requirements.

Q3: Can the wafer specifications be customized?
A: Yes. FUYAO QUARTZ provides customization options including wafer thickness, doping type, resistivity range, surface treatment, and wafer size. Custom specifications can be tailored according to semiconductor device design or research requirements.

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