{"id":3058,"date":"2026-06-10T03:45:55","date_gmt":"2026-06-10T03:45:55","guid":{"rendered":"https:\/\/www.fuyao-quartz.com\/?p=3058"},"modified":"2026-06-10T03:46:08","modified_gmt":"2026-06-10T03:46:08","slug":"fracture-mechanism-of-fused-silica-glass-wafers-during-double-sided-polishing-process","status":"publish","type":"post","link":"https:\/\/www.fuyao-quartz.com\/sv\/fracture-mechanism-of-fused-silica-glass-wafers-during-double-sided-polishing-process\/","title":{"rendered":"Brottmekanism hos skivor av sm\u00e4lt kvartsglas under dubbelsidig polering"},"content":{"rendered":"<h2 class=\"wp-block-heading\">1. Inledning<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Dubbelsidig polering (DSP) \u00e4r det sista och viktigaste steget i den mekaniska bearbetningen av skivor av sm\u00e4lt kvartsglas. Det \u00e4r ocks\u00e5 det l\u00e4ngsta bearbetningssteget och spelar en avg\u00f6rande roll f\u00f6r slutproduktens kvalitet.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Under denna process \u00e4r vanliga ytdefekter bland annat gropar, repor, kantflisning, sprickor och fullst\u00e4ndiga skivbrott. Av dessa kan gropar och repor ofta minimeras eller till och med repareras genom processoptimering och milj\u00f6kontroll. Kantflisning, sprickor och skivbrott \u00e4r dock irreversibla defekter som direkt leder till att skivorna kasseras.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">N\u00e4r det g\u00e4ller ultratunna skivor av sm\u00e4lt kvarts \u00e4r sprickrelaterade defekter fortfarande den st\u00f6rsta utmaningen f\u00f6r att uppn\u00e5 h\u00f6g avkastning och stabil produktion.<\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-large\"><img fetchpriority=\"high\" decoding=\"async\" width=\"1024\" height=\"430\" src=\"https:\/\/www.fuyao-quartz.com\/wp-content\/uploads\/2026\/06\/Fracture-Mechanism-of-Fused-Silica-Glass-Wafers-During-Double-Sided-Polishing-Process-1024x430.png\" alt=\"\" class=\"wp-image-3059\" srcset=\"https:\/\/www.fuyao-quartz.com\/wp-content\/uploads\/2026\/06\/Fracture-Mechanism-of-Fused-Silica-Glass-Wafers-During-Double-Sided-Polishing-Process-1024x430.png 1024w, https:\/\/www.fuyao-quartz.com\/wp-content\/uploads\/2026\/06\/Fracture-Mechanism-of-Fused-Silica-Glass-Wafers-During-Double-Sided-Polishing-Process-300x126.png 300w, https:\/\/www.fuyao-quartz.com\/wp-content\/uploads\/2026\/06\/Fracture-Mechanism-of-Fused-Silica-Glass-Wafers-During-Double-Sided-Polishing-Process-768x323.png 768w, https:\/\/www.fuyao-quartz.com\/wp-content\/uploads\/2026\/06\/Fracture-Mechanism-of-Fused-Silica-Glass-Wafers-During-Double-Sided-Polishing-Process-1536x645.png 1536w, https:\/\/www.fuyao-quartz.com\/wp-content\/uploads\/2026\/06\/Fracture-Mechanism-of-Fused-Silica-Glass-Wafers-During-Double-Sided-Polishing-Process-18x8.png 18w, https:\/\/www.fuyao-quartz.com\/wp-content\/uploads\/2026\/06\/Fracture-Mechanism-of-Fused-Silica-Glass-Wafers-During-Double-Sided-Polishing-Process-600x252.png 600w, https:\/\/www.fuyao-quartz.com\/wp-content\/uploads\/2026\/06\/Fracture-Mechanism-of-Fused-Silica-Glass-Wafers-During-Double-Sided-Polishing-Process.png 1699w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">2. Olika typer av frakturdefekter<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Frakturdefekter i <a href=\"https:\/\/www.fuyao-quartz.com\/sv\/product-category\/quartz-wafer\/\">glasplattor<\/a> omfattar i allm\u00e4nhet tre kategorier:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Kantflisning (kantbrott)<\/strong><br>Definieras vanligtvis som synliga skador p\u00e5 kanterna eller saknade fragment som \u00e4r l\u00e4ngre \u00e4n 0,3 mm.<\/li>\n\n\n\n<li><strong>Sprickutbredning<\/strong><br>Sprickor uppst\u00e5r ofta vid flisade kanter och breder sig gradvis in i skivans inre.<\/li>\n\n\n\n<li><strong>Fullst\u00e4ndig fraktur (brott)<\/strong><br>Om sprickorna sprider sig under belastning i samband med vidare bearbetning eller hantering uppst\u00e5r ett katastrofalt fel p\u00e5 skivan.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">I industriell praxis klassificeras en kiselplatta vanligtvis som en defekt produkt och tas bort fr\u00e5n vidare bearbetning s\u00e5 snart kantflisning uppt\u00e4cks, eftersom risken f\u00f6r fel i efterf\u00f6ljande steg \u00e4r stor.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">3. Frakturens uppkomst vid dubbelsidig polering<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Under DSP-processen genomg\u00e5r kiselskivan en komplex r\u00f6relse som styrs av:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Rotation av den \u00f6vre plattan<\/li>\n\n\n\n<li>Rotation av den nedre plattan<\/li>\n\n\n\n<li>Solhjulets rotation<\/li>\n\n\n\n<li>R\u00f6relse hos drivhjulet (planethjulet)<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Under dessa f\u00f6rh\u00e5llanden uts\u00e4tts skivan f\u00f6r en kombinerad r\u00f6relse best\u00e5ende av rotation och egenrotation, vilket g\u00f6r en exakt sp\u00e4nningsanalys mycket komplex.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Produktionsstatistiken visar dock en tydlig trend: sprickor uppst\u00e5r n\u00e4stan alltid vid kanten av kiselskivan. Detta tyder p\u00e5 att kiselskivans kantstyrka \u00e4r den avg\u00f6rande faktorn f\u00f6r sprickbeteendet.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">4. Kantstyrka som den avg\u00f6rande felorsaken<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Hur motst\u00e5ndskraftig en skiva av sm\u00e4lt kvarts \u00e4r mot sprickbildning beror fr\u00e4mst p\u00e5 dess kantstyrka.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">F\u00f6r att f\u00f6rb\u00e4ttra den mekaniska stabiliteten uts\u00e4tts skivorna vanligtvis f\u00f6r <strong>kantfasning (avfasning)<\/strong>, vilket bidrar till att minska sp\u00e4nningskoncentrationen vid kanterna. En korrekt utformad fas f\u00f6rb\u00e4ttrar brottmotst\u00e5ndet avsev\u00e4rt.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Men \u00e4ven med kantskydd kan felaktiga bearbetningsparametrar eller alltf\u00f6r stor mekanisk belastning fortfarande leda till att skador uppst\u00e5r i det fasade omr\u00e5det.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">5. Sp\u00e4nningsanalys vid kanten av kiselskivan<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Under DSP uts\u00e4tts kanten p\u00e5 kiselskivan f\u00f6r en kombination av krafter:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>F\u2081: Vertikal tryckkraft<\/strong><br>Orsakas fr\u00e4mst av poleringstrycket fr\u00e5n den \u00f6vre plattan.<\/li>\n\n\n\n<li><strong>F\u2082: Horisontell kraft<\/strong><br>Orsakas fr\u00e4mst av centrifugalkrafter under rotation och reaktionskraften fr\u00e5n b\u00e4rarsystemet.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Vid den avfasade kanten kan dessa krafter delas upp i f\u00f6ljande:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Normalkrafter vinkelr\u00e4ta mot fasytan<\/li>\n\n\n\n<li>Tangentiella krafter parallella med fasytan<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Det sammansatta sp\u00e4nningstillst\u00e5ndet kan uttryckas som en superposition av:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Normal sp\u00e4nning (tryck- och dragkomponenter)<\/li>\n\n\n\n<li>Skjuvsp\u00e4nning (glidkomponenter)<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">N\u00e4r dessa sp\u00e4nningar \u00f6verskrider den mekaniska h\u00e5llfasthetsgr\u00e4nsen f\u00f6r sm\u00e4lt kvarts uppst\u00e5r sprickbildning, som vanligtvis b\u00f6rjar vid kanten och sprider sig in\u00e5t.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">6. Felmekanismer i ultratunna skivor<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">F\u00f6r ultratunna skivor av sm\u00e4lt kvarts (vanligtvis med en tjocklek p\u00e5 &lt; 0,3 mm) \u00f6kar risken f\u00f6r brott avsev\u00e4rt p\u00e5 grund av flera faktorer:<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">6.1 Minskad konstruktionsh\u00e5llfasthet<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">N\u00e4r tjockleken minskar minskar skivans totala mekaniska styvhet avsev\u00e4rt, vilket g\u00f6r den mer k\u00e4nslig f\u00f6r yttre p\u00e5frestningar.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">6.2 Minskat skyddsomr\u00e5de f\u00f6r fasning<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Ultratunna skivor har en betydligt mindre fasvolym och kontaktyta. Detta leder till att den skyddande effekten av kantfasningen f\u00f6rsvagas.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">6.3 \u00d6kad sp\u00e4nningskoncentration<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Under samma poleringsf\u00f6rh\u00e5llanden:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Kontaktytan minskar<\/li>\n\n\n\n<li>Den lokala sp\u00e4nningen per ytenhet \u00f6kar<\/li>\n\n\n\n<li>Sp\u00e4nningskoncentrationen vid kanten blir betydligt h\u00f6gre<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Detta leder till en snabb \u00f6kning av b\u00e5de normal- och skjuvsp\u00e4nningen vid kanten.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">7. Slutsatser<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Sprickbildning i skivor av sm\u00e4lt kvartsglas under dubbelsidig polering orsakas fr\u00e4mst av f\u00f6r h\u00f6g sp\u00e4nning vid skivans kant. N\u00e4r de sammanlagda normal- och skjuvsp\u00e4nningarna \u00f6verskrider materialets mekaniska h\u00e5llfasthetsgr\u00e4ns uppst\u00e5r kantflisning, sprickutbredning och slutligen brott.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Ultratunna skivor \u00e4r s\u00e4rskilt k\u00e4nsliga p\u00e5 grund av sin minskade tjocklek, f\u00f6rsvagat kantskydd och \u00f6kad sp\u00e4nningskoncentration.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">F\u00f6r att f\u00f6rb\u00e4ttra utbytet av kiselskivor kr\u00e4vs d\u00e4rf\u00f6r ett starkt fokus p\u00e5:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Optimering av kantstyrka<\/li>\n\n\n\n<li>F\u00f6rb\u00e4ttring av fasutformningen<\/li>\n\n\n\n<li>Reglering av poleringstrycket<\/li>\n\n\n\n<li>Optimering av rotationshastigheten<\/li>\n\n\n\n<li>F\u00f6rb\u00e4ttring av processstabiliteten<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Genom att noggrant kontrollera dessa faktorer kan risken f\u00f6r sprickbildning minskas avsev\u00e4rt, vilket leder till h\u00f6gre utbyte och f\u00f6rb\u00e4ttrad tillverkningss\u00e4kerhet vid tillverkningen av skivor av sm\u00e4lt kvarts.<\/p>","protected":false},"excerpt":{"rendered":"<p>1. Introduction Double-sided polishing (DSP) is the final and most critical step in the mechanical processing of fused silica glass wafers. It is also the longest processing stage and plays a decisive role in final product quality. During this process, common surface defects include pits, scratches, edge chipping, cracks, and complete wafer breakage. Among these, [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":3059,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[1],"tags":[1373,1366,1367,1370,506,1352,1379,1375,1376,1377,1350,1351,1372,1369,1368,1365,1371,1364,1378,1374],"class_list":["post-3058","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry-news","tag-chamfering-process","tag-double-sided-polishing","tag-dsp-process","tag-edge-chipping","tag-fused-silica-wafer","tag-glass-wafer","tag-microcrack-propagation","tag-normal-stress","tag-optical-glass-wafer","tag-precision-polishing","tag-quartz-wafer","tag-semiconductor-substrate","tag-shear-stress","tag-ultra-thin-wafer-processing","tag-wafer-breakage","tag-wafer-cracking","tag-wafer-edge-strength","tag-wafer-fracture-mechanism","tag-wafer-manufacturing-defects","tag-wafer-polishing-stress"],"_links":{"self":[{"href":"https:\/\/www.fuyao-quartz.com\/sv\/wp-json\/wp\/v2\/posts\/3058","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.fuyao-quartz.com\/sv\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.fuyao-quartz.com\/sv\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.fuyao-quartz.com\/sv\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.fuyao-quartz.com\/sv\/wp-json\/wp\/v2\/comments?post=3058"}],"version-history":[{"count":1,"href":"https:\/\/www.fuyao-quartz.com\/sv\/wp-json\/wp\/v2\/posts\/3058\/revisions"}],"predecessor-version":[{"id":3060,"href":"https:\/\/www.fuyao-quartz.com\/sv\/wp-json\/wp\/v2\/posts\/3058\/revisions\/3060"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.fuyao-quartz.com\/sv\/wp-json\/wp\/v2\/media\/3059"}],"wp:attachment":[{"href":"https:\/\/www.fuyao-quartz.com\/sv\/wp-json\/wp\/v2\/media?parent=3058"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.fuyao-quartz.com\/sv\/wp-json\/wp\/v2\/categories?post=3058"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.fuyao-quartz.com\/sv\/wp-json\/wp\/v2\/tags?post=3058"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}