{"id":2811,"date":"2026-04-28T09:31:12","date_gmt":"2026-04-28T09:31:12","guid":{"rendered":"https:\/\/www.fuyao-quartz.com\/?post_type=product&p=2811"},"modified":"2026-04-28T09:31:19","modified_gmt":"2026-04-28T09:31:19","slug":"sapphire-through-glass-via-tgv-substrate-for-mems-sensors-and-advanced-semiconductor-packaging","status":"publish","type":"product","link":"https:\/\/www.fuyao-quartz.com\/ru\/product\/sapphire-through-glass-via-tgv-substrate-for-mems-sensors-and-advanced-semiconductor-packaging\/","title":{"rendered":"\u0421\u0430\u043f\u0444\u0438\u0440\u043e\u0432\u0430\u044f \u043f\u043e\u0434\u043b\u043e\u0436\u043a\u0430 \u0438\u0437 \u0441\u043a\u0432\u043e\u0437\u043d\u043e\u0433\u043e \u0441\u0442\u0435\u043a\u043b\u0430 TGV \u0434\u043b\u044f \u041c\u042d\u041c\u0421, \u0441\u0435\u043d\u0441\u043e\u0440\u043e\u0432 \u0438 \u043f\u0435\u0440\u0435\u0434\u043e\u0432\u043e\u0439 \u043f\u043e\u043b\u0443\u043f\u0440\u043e\u0432\u043e\u0434\u043d\u0438\u043a\u043e\u0432\u043e\u0439 \u0443\u043f\u0430\u043a\u043e\u0432\u043a\u0438"},"content":{"rendered":"
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\"SapphireThe Sapphire Through Glass Via (TGV) Substrate is a high-precision microfabricated interposer designed for advanced semiconductor packaging, MEMS devices, and sensor integration. Built on premium Sapphire (Al\u2082O\u2083 single crystal)<\/span><\/span> substrates, this technology enables vertical electrical interconnections through ultra-hard, optically transparent, and chemically stable materials.<\/p>\n

Compared to traditional silicon or glass interposers, sapphire-based TGV substrates offer superior mechanical strength, higher thermal stability, and enhanced reliability in harsh environments. These advantages make them particularly suitable for high-frequency, high-density, and high-reliability applications such as RF devices, optical sensors, and advanced packaging architectures (2.5D\/3D integration).<\/p>\n

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Key Features & Advantages<\/h2>\n

1. High-Density Vertical Interconnection<\/h3>\n

TGV technology enables compact and efficient vertical electrical pathways through sapphire substrates, supporting high-density integration required in modern semiconductor packaging and miniaturized devices.<\/p>\n

2. Superior Mechanical Strength<\/h3>\n

Sapphire\u2019s high hardness (Mohs 9) ensures excellent structural integrity, making the substrate resistant to cracking, warping, and mechanical damage during processing and operation.<\/p>\n

3. Excellent High-Frequency Performance<\/h3>\n

With low dielectric loss, minimal parasitic capacitance, and reduced inductance, sapphire TGV substrates are ideal for RF, 5G, and high-speed signal transmission applications.<\/p>\n

4. Outstanding Thermal Stability<\/h3>\n

Sapphire maintains excellent performance under extreme temperatures, making it suitable for high-power and thermally demanding environments.<\/p>\n

5. Chemical Resistance and Hermeticity<\/h3>\n

The material is highly resistant to acids, alkalis, and corrosive environments. TGV structures can also achieve excellent hermetic sealing performance, ensuring long-term reliability.<\/p>\n

6. Optical Transparency<\/h3>\n

Unlike silicon interposers, sapphire substrates offer optical transparency across UV\u2013IR ranges, enabling integration with optical sensors, photonics, and imaging systems.<\/p>\n

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Technical Specifications<\/h2>\n
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\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
Parameter<\/th>\nSpecification<\/th>\n<\/tr>\n<\/thead>\n
Product Name<\/td>\nSapphire TGV Substrate<\/td>\n<\/tr>\n
Material<\/td>\nSingle-crystal Sapphire (Al\u2082O\u2083)<\/td>\n<\/tr>\n
Wafer Size<\/td>\nUp to 300 mm<\/td>\n<\/tr>\n
Panel Size<\/td>\nUp to 515 \u00d7 515 mm<\/td>\n<\/tr>\n
Thickness<\/td>\n0.1 \u2013 0.7 mm (customizable)<\/td>\n<\/tr>\n
Min. Thickness<\/td>\n0.3 mm<\/td>\n<\/tr>\n
Via Diameter (OD)<\/td>\n25 \u2013 100 \u03bcm<\/td>\n<\/tr>\n
Min. Pitch<\/td>\n~2 \u00d7 via diameter<\/td>\n<\/tr>\n
Via Type<\/td>\nThrough \/ Blind<\/td>\n<\/tr>\n
Via Shape<\/td>\nStraight<\/td>\n<\/tr>\n
Aspect Ratio<\/td>\nUp to 1:5<\/td>\n<\/tr>\n
Via Material<\/td>\nTungsten (W) \/ Silicon (Si)<\/td>\n<\/tr>\n
Hermeticity<\/td>\n\u2264 1\u00d710\u207b\u2079 Pa\u00b7m\u00b3\/s<\/td>\n<\/tr>\n
Tolerance<\/td>\n\u00b120 \u03bcm (per 200 mm wafer)<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
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\"SapphireManufacturing Process<\/h2>\n

Sapphire TGV substrates are fabricated using advanced laser-induced modification combined with chemical etching<\/strong>:<\/p>\n

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  1. Laser Structuring<\/strong> \u2013 A precision laser modifies the internal structure of sapphire in predefined via regions<\/li>\n
  2. Selective Etching<\/strong> \u2013 Modified regions are etched at faster rates, forming clean, high-aspect-ratio vias<\/li>\n
  3. Metallization<\/strong> \u2013 Vias are filled with conductive materials such as tungsten or silicon<\/li>\n
  4. Optional Processes<\/strong> \u2013 Including cavity formation, bumping, and surface metallization<\/li>\n<\/ol>\n

    This process ensures:<\/p>\n

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    • Crack-free via formation<\/li>\n
    • High dimensional accuracy<\/li>\n
    • Smooth via sidewalls<\/li>\n
    • Compatibility with high-density designs<\/li>\n<\/ul>\n
      \n

      Applications<\/h2>\n

      Semiconductor Packaging<\/h3>\n
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      • 2.5D \/ 3D interposers<\/li>\n
      • Wafer-level chip scale packaging (WL-CSP)<\/li>\n
      • High-density interconnects<\/li>\n<\/ul>\n

        MEMS & Sensors<\/h3>\n
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        • Pressure sensors<\/li>\n
        • Optical sensors<\/li>\n
        • Microfluidic devices<\/li>\n<\/ul>\n

          RF & 5G Devices<\/h3>\n
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          • High-frequency modules<\/li>\n
          • Low-loss signal transmission systems<\/li>\n<\/ul>\n

            Photonics & Optical Integration<\/h3>\n
              \n
            • Optical interposers<\/li>\n
            • Imaging systems<\/li>\n
            • Transparent sensor packaging<\/li>\n<\/ul>\n

              High-Performance Computing & IoT<\/h3>\n
                \n
              • High-bandwidth data transmission<\/li>\n
              • Compact and high-density integration<\/li>\n<\/ul>\n
                \n

                Customization Capabilities<\/h2>\n

                \"Sapphire<\/p>\n

                We provide fully customizable sapphire TGV solutions<\/strong> tailored to your application requirements:<\/p>\n

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                • Via diameter, pitch, and density optimization<\/li>\n
                • Wafer or panel-level customization<\/li>\n
                • Through or blind via design<\/li>\n
                • Metallization (W, Cu, or custom materials)<\/li>\n
                • Surface finishing and polishing<\/li>\n
                • Integration with bonding processes (e.g., anodic bonding)<\/li>\n
                • High-precision tolerance control<\/li>\n<\/ul>\n
                  \n

                  FAQ<\/h2>\n

                  Q1: What is the advantage of sapphire TGV over glass or silicon TGV?<\/strong>
                  A1: Sapphire offers higher mechanical strength, better thermal stability, and optical transparency, making it more suitable for harsh environments and optical-integrated applications.<\/p>\n

                  Q2: Can via size and pitch be customized?<\/strong>
                  A2: Yes. Via diameter, pitch, and layout can be fully customized according to your design requirements.<\/p>\n

                  Q3: Is sapphire TGV suitable for high-frequency applications?<\/strong>
                  A3: Absolutely. Its low dielectric loss and excellent electrical properties make it ideal for RF, 5G, and high-speed signal transmission systems.<\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n

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                  <\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/section>\n
                  <\/div>\n","protected":false},"excerpt":{"rendered":"

                  \u041f\u043e\u0434\u043b\u043e\u0436\u043a\u0438 Sapphire TGV \u043f\u0440\u0435\u0434\u0441\u0442\u0430\u0432\u043b\u044f\u044e\u0442 \u0441\u043e\u0431\u043e\u0439 \u0441\u043b\u0435\u0434\u0443\u044e\u0449\u0435\u0435 \u043f\u043e\u043a\u043e\u043b\u0435\u043d\u0438\u0435 \u043f\u0435\u0440\u0435\u0434\u043e\u0432\u044b\u0445 \u0442\u0435\u0445\u043d\u043e\u043b\u043e\u0433\u0438\u0439 \u043c\u0435\u0436\u0441\u043e\u0435\u0434\u0438\u043d\u0435\u043d\u0438\u0439, \u0441\u043e\u0447\u0435\u0442\u0430\u044f \u0438\u0441\u043a\u043b\u044e\u0447\u0438\u0442\u0435\u043b\u044c\u043d\u044b\u0435 \u0441\u0432\u043e\u0439\u0441\u0442\u0432\u0430 \u043c\u0430\u0442\u0435\u0440\u0438\u0430\u043b\u0430 \u0441\u0430\u043f\u0444\u0438\u0440\u0430 \u0441 \u043f\u0435\u0440\u0435\u0434\u043e\u0432\u044b\u043c\u0438 \u0442\u0435\u0445\u043d\u043e\u043b\u043e\u0433\u0438\u044f\u043c\u0438 \u043c\u0438\u043a\u0440\u043e\u0444\u0430\u0431\u0440\u0438\u043a\u0430\u0446\u0438\u0438. \u041e\u043d\u0438 \u043e\u0431\u0435\u0441\u043f\u0435\u0447\u0438\u0432\u0430\u044e\u0442 \u043d\u0430\u0434\u0435\u0436\u043d\u0443\u044e \u043f\u043b\u0430\u0442\u0444\u043e\u0440\u043c\u0443 \u0434\u043b\u044f \u0432\u044b\u0441\u043e\u043a\u043e\u0447\u0430\u0441\u0442\u043e\u0442\u043d\u044b\u0445, \u0432\u044b\u0441\u043e\u043a\u043e\u043f\u043b\u043e\u0442\u043d\u044b\u0445 \u0438 \u0432\u044b\u0441\u043e\u043a\u043e\u043f\u0440\u043e\u0438\u0437\u0432\u043e\u0434\u0438\u0442\u0435\u043b\u044c\u043d\u044b\u0445 \u044d\u043b\u0435\u043a\u0442\u0440\u043e\u043d\u043d\u044b\u0445 \u0438 \u0444\u043e\u0442\u043e\u043d\u043d\u044b\u0445 \u0441\u0438\u0441\u0442\u0435\u043c. \u041e\u0431\u043b\u0430\u0434\u0430\u044f \u043f\u0440\u0435\u0432\u043e\u0441\u0445\u043e\u0434\u043d\u043e\u0439 \u0433\u0438\u0431\u043a\u043e\u0441\u0442\u044c\u044e \u0432 \u043d\u0430\u0441\u0442\u0440\u043e\u0439\u043a\u0435, \u0441\u0430\u043f\u0444\u0438\u0440\u043e\u0432\u044b\u0435 TGV-\u0440\u0435\u0448\u0435\u043d\u0438\u044f \u0438\u0434\u0435\u0430\u043b\u044c\u043d\u043e \u043f\u043e\u0434\u0445\u043e\u0434\u044f\u0442 \u0434\u043b\u044f \u043f\u043e\u043b\u0443\u043f\u0440\u043e\u0432\u043e\u0434\u043d\u0438\u043a\u043e\u0432\u044b\u0445 \u0438 \u0441\u0435\u043d\u0441\u043e\u0440\u043d\u044b\u0445 \u043f\u0440\u0438\u043b\u043e\u0436\u0435\u043d\u0438\u0439 \u0441\u043b\u0435\u0434\u0443\u044e\u0449\u0435\u0433\u043e \u043f\u043e\u043a\u043e\u043b\u0435\u043d\u0438\u044f.<\/p>","protected":false},"featured_media":2816,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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