{"id":2988,"date":"2026-06-02T05:53:16","date_gmt":"2026-06-02T05:53:16","guid":{"rendered":"https:\/\/www.fuyao-quartz.com\/?post_type=product&p=2988"},"modified":"2026-06-02T05:53:20","modified_gmt":"2026-06-02T05:53:20","slug":"sapphire-temporary-wafer-carrier-for-advanced-semiconductor-packaging","status":"publish","type":"product","link":"https:\/\/www.fuyao-quartz.com\/hu\/product\/sapphire-temporary-wafer-carrier-for-advanced-semiconductor-packaging\/","title":{"rendered":"Sapphire ideiglenes ostyahordoz\u00f3 fejlett f\u00e9lvezet\u0151-csomagol\u00e1shoz"},"content":{"rendered":"

A zaf\u00edr ideiglenes szil\u00edciumlapka-hordoz\u00f3 egy fejlett m\u0171szaki hordoz\u00f3anyag, amelyet a k\u00f6vetkez\u0151 gener\u00e1ci\u00f3s f\u00e9lvezet\u0151-csomagol\u00e1s sor\u00e1n v\u00e9gzett ultrav\u00e9kony szil\u00edciumlapka-megmunk\u00e1l\u00e1shoz terveztek. Sz\u00e9les k\u00f6rben alkalmazz\u00e1k a 2,5D\/3D integr\u00e1lt \u00e1ramk\u00f6r\u00f6k integr\u00e1l\u00e1s\u00e1ban, a TSV- \u00e9s RDL-technol\u00f3gi\u00e1kban, a fan-out csomagol\u00e1sban, valamint egy\u00e9b olyan fejlett v\u00e9gs\u0151 f\u00e1zis\u00fa folyamatokban, amelyek ideiglenes szil\u00edciumlapka-t\u00e1maszt\u00e1st ig\u00e9nyelnek.<\/p>\n

A term\u00e9k nagy merevs\u00e9g\u0171, rendk\u00edv\u00fcl s\u00edk \u00e9s h\u0151stabil fel\u00fcletet biztos\u00edt a szil\u00edciumlapok v\u00e9kony\u00edt\u00e1s\u00e1hoz, valamint az ideiglenes ragaszt\u00e1si \u00e9s lev\u00e1laszt\u00e1si folyamatokhoz. Kifejezetten az 50 \u03bcm alatti ultrav\u00e9kony szil\u00edciumlapokn\u00e1l el\u0151fordul\u00f3 deform\u00e1ci\u00f3, fesz\u00fclts\u00e9gfelhalmoz\u00f3d\u00e1s \u00e9s mechanikai instabilit\u00e1s kezel\u00e9s\u00e9re tervezt\u00e9k.<\/p>\n

\"\"<\/p>\n

\n

\"\"Az ipar\u00e1g legf\u0151bb probl\u00e9m\u00e1i<\/strong><\/span><\/h2>\n

Ahogy a fejlett csomagol\u00e1si technol\u00f3gi\u00e1k egyre nagyobb s\u0171r\u0171s\u00e9g\u0171 \u00e9s v\u00e9konyabb szerkezetek fel\u00e9 fejl\u0151dnek, a gy\u00e1rt\u00e1si folyamatok instabilit\u00e1sa kulcsfontoss\u00e1g\u00fa korl\u00e1tot jelent.<\/p>\n

A legfontosabb kih\u00edv\u00e1sok a k\u00f6vetkez\u0151k:<\/p>\n

    \n
  • A szil\u00edciumlapka, az aljzat, az interposer, az al\u00e1t\u00f6lt\u0151 anyag \u00e9s a form\u00e1z\u00f3anyagok k\u00f6z\u00f6tti CTE-elt\u00e9r\u00e9s<\/li>\n
  • A stressz felhalmoz\u00f3d\u00e1sa ism\u00e9telt h\u0151ciklusos folyamatok sor\u00e1n<\/li>\n
  • A ragaszt\u00f3 k\u00f6t\u00e9skori zsugorod\u00e1sa \u00e9s az anyag deform\u00e1ci\u00f3ja<\/li>\n
  • Aszimmetrikus r\u00e9tegszerkezet az ultrav\u00e9kony szil\u00edciumlapka-csomagol\u00e1sban<\/li>\n
  • Az ostya deform\u00e1l\u00f3d\u00e1sa, ami be\u00e1ll\u00edt\u00e1si elt\u00e9r\u00e9shez \u00e9s hozamcs\u00f6kken\u00e9shez vezet<\/li>\n
  • Az ultrav\u00e9kony szil\u00edciumlapok mechanikai t\u00f6r\u00e9kenys\u00e9ge a kezel\u00e9s \u00e9s sz\u00e1ll\u00edt\u00e1s sor\u00e1n<\/li>\n<\/ul>\n

    Ezek a t\u00e9nyez\u0151k jelent\u0151sen befoly\u00e1solj\u00e1k a gy\u00e1rt\u00e1si hozamot, az eszk\u00f6z\u00f6k megb\u00edzhat\u00f3s\u00e1g\u00e1t \u00e9s a gy\u00e1rt\u00e1s hat\u00e9konys\u00e1g\u00e1t.<\/p>\n

    \n

    \"\"Anyagmegold\u00e1s<\/strong><\/span><\/h2>\n

    A zaf\u00edr a mechanikai merevs\u00e9g, az optikai \u00e1tl\u00e1tsz\u00f3s\u00e1g \u00e9s a h\u0151stabilit\u00e1s egyed\u00fcl\u00e1ll\u00f3 kombin\u00e1ci\u00f3j\u00e1t k\u00edn\u00e1lja, ami ide\u00e1lis anyagg\u00e1 teszi ideiglenes szil\u00edciumlapka-hordoz\u00f3 alkalmaz\u00e1sokhoz.<\/p>\n

    A rendelkez\u00e9s a k\u00f6vetkez\u0151ket \u00edrja el\u0151:<\/p>\n

      \n
    • Stabil mechanikai t\u00e1maszt\u00e9k ultrav\u00e9kony szil\u00edciumlapokhoz<\/li>\n
    • Alacsony alakv\u00e1ltoz\u00e1s h\u0151- \u00e9s mechanikai ig\u00e9nybev\u00e9tel eset\u00e9n<\/li>\n
    • Kiv\u00e1l\u00f3 kompatibilit\u00e1s a l\u00e9zeres lev\u00e1laszt\u00e1si elj\u00e1r\u00e1sokkal<\/li>\n
    • Egyenletes fesz\u00fclts\u00e9geloszl\u00e1s nagy fel\u00fclet\u0171 hordoz\u00f3kon<\/li>\n
    • Kiv\u00e1l\u00f3 tart\u00f3ss\u00e1g ism\u00e9telt ipari haszn\u00e1latra<\/li>\n<\/ul>\n
      \n

      A legfontosabb teljes\u00edtm\u00e9nybeli el\u0151ny\u00f6k<\/strong><\/span><\/h2>\n

      Rendk\u00edv\u00fcl nagy merevs\u00e9g (Young-modulus: 345\u2013420 GPa)<\/strong>
      Hat\u00e9konyan cs\u00f6kkenti az ostya hajl\u00edt\u00e1s\u00e1t \u00e9s deform\u00e1l\u00f3d\u00e1s\u00e1t h\u0151ciklusok \u00e9s mechanikai megmunk\u00e1l\u00e1s sor\u00e1n.<\/p>\n

      Kiv\u00e1l\u00f3 mechanikai szil\u00e1rds\u00e1g (Vickers-kem\u00e9nys\u00e9g: 1800\u20132200 HV)<\/strong>
      Kiv\u00e1l\u00f3 ellen\u00e1ll\u00e1st biztos\u00edt a fel\u00fcleti s\u00e9r\u00fcl\u00e9sekkel szemben, \u00e9s hossz\u00fa \u00e9lettartamot garant\u00e1l ism\u00e9telt feldolgoz\u00e1si k\u00f6r\u00fclm\u00e9nyek k\u00f6z\u00f6tt.<\/p>\n

      Magas optikai \u00e1tl\u00e1tsz\u00f3s\u00e1g (>83%, 300\u20131200 nm)<\/strong>
      Lehet\u0151v\u00e9 teszi a hat\u00e9kony l\u00e9zeres \u00e1tvitelt a ragaszt\u00e1s elt\u00e1vol\u00edt\u00e1si folyamatokhoz, valamint a kompatibilit\u00e1st sz\u00e1mos ideiglenes ragaszt\u00e1si technol\u00f3gi\u00e1val.<\/p>\n

      Kiv\u00e1l\u00f3 anyagegys\u00e9gess\u00e9g<\/strong>
      Biztos\u00edtja az egyenletes fesz\u00fclts\u00e9geloszl\u00e1st a nagy m\u00e9ret\u0171 szil\u00edciumlapok \u00e9s panelek fel\u00fclet\u00e9n, cs\u00f6kkentve ezzel a helyi deform\u00e1ci\u00f3kat.<\/p>\n

      H\u0151- \u00e9s k\u00e9miai stabilit\u00e1s<\/strong>
      Magas h\u0151m\u00e9rs\u00e9klet\u0171 folyamatok \u00e9s vegyi tiszt\u00edt\u00e1si k\u00f6r\u00fclm\u00e9nyek k\u00f6z\u00f6tt is meg\u0151rzi szerkezeti integrit\u00e1s\u00e1t.<\/p>\n

      \n

      M\u0171szaki specifik\u00e1ci\u00f3k<\/strong><\/span><\/h2>\n

      Oszlopok \u00e9s panelek m\u00e9retei<\/strong><\/span><\/h3>\n
      \n
      \n\n\n\n\n\n\n\n
      Param\u00e9ter<\/th>\nSpecifik\u00e1ci\u00f3<\/th>\n<\/tr>\n<\/thead>\n
      Wafer m\u00e9ret<\/td>\n20 cm \/ 30 cm<\/td>\n<\/tr>\n
      Panel m\u00e9rete<\/td>\n100 \u00d7 100 mm \u2013 510 \u00d7 515 mm<\/td>\n<\/tr>\n
      Vastags\u00e1gtartom\u00e1ny<\/td>\n0,7\u20132,0 mm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
      \n

      M\u00e9ret- \u00e9s fel\u00fcleti min\u0151s\u00e9g<\/strong><\/span><\/h3>\n
      \n
      \n\n\n\n\n\n\n\n\n\n
      Ingatlan<\/th>\nNorm\u00e1l min\u0151s\u00e9g<\/th>\nKiv\u00e1l\u00f3 pontoss\u00e1g\u00fa min\u0151s\u00e9g<\/th>\n<\/tr>\n<\/thead>\n
      Teljes vastags\u00e1gv\u00e1ltoz\u00e1s (TTV)<\/td>\n\u2264 3 \u03bcm<\/td>\n\u2264 2 \u03bcm<\/td>\n<\/tr>\n
      Warp<\/td>\n\u2264 100 \u03bcm<\/td>\n\u2264 50 \u03bcm<\/td>\n<\/tr>\n
      Vastags\u00e1g t\u0171r\u00e9s<\/td>\n\u00b10,010 mm<\/td>\n\u00b10,005 mm<\/td>\n<\/tr>\n
      Fel\u00fcleti \u00e9rdess\u00e9g (Ra)<\/td>\n< 1,0 nm<\/td>\n< 1,0 nm<\/td>\n<\/tr>\n
      Karcol\u00e1s\/\u00c1s\u00e1s<\/td>\n60\/40<\/td>\n40\/20<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
      \n

      Anyagjellemz\u0151k<\/strong><\/span><\/h3>\n
      \n
      \n\n\n\n\n\n\n\n\n\n\n
      Ingatlan<\/th>\n\u00c9rt\u00e9k<\/th>\n<\/tr>\n<\/thead>\n
      Young modulus<\/td>\n345\u2013420 GPa<\/td>\n<\/tr>\n
      Vickers-kem\u00e9nys\u00e9g<\/td>\n1800 \u2013 2200 HV<\/td>\n<\/tr>\n
      Optikai \u00e1tl\u00e1tsz\u00f3s\u00e1g<\/td>\n>83% (300\u20131200 nm)<\/td>\n<\/tr>\n
      S\u0171r\u0171s\u00e9g<\/td>\n3,98 g\/cm\u00b3<\/td>\n<\/tr>\n
      H\u0151vezet\u0151 k\u00e9pess\u00e9g<\/td>\n30\u201340 W\/m\u00b7K<\/td>\n<\/tr>\n
      CTE (20 \u00b0C)<\/td>\n5,6 \u2013 7,7 \u00d7 10\u207b\u2076\/K<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
      \n

      \"\"A hat\u00e1lya<\/strong><\/span><\/h2>\n
        \n
      • Ultrav\u00e9kony szil\u00edciumlapka h\u00e1toldal\u00e1nak megmunk\u00e1l\u00e1sa<\/li>\n
      • 2,5D\/3D integr\u00e1lt \u00e1ramk\u00f6r\u00f6k heterog\u00e9n integr\u00e1ci\u00f3ja<\/li>\n
      • TSV (Through-Silicon Via) elj\u00e1r\u00e1sok<\/li>\n
      • RDL (\u00fajraeloszt\u00f3 r\u00e9teg) gy\u00e1rt\u00e1sa<\/li>\n
      • Az ostya ideiglenes \u00f6sszeragaszt\u00e1sa \u00e9s sz\u00e9tv\u00e1laszt\u00e1sa<\/li>\n
      • Panel szint\u0171 el\u00e1gaz\u00f3 csomagol\u00e1s (FOPLP)<\/li>\n
      • Fejlett ostyav\u00e9kony\u00edt\u00e1s (<50 \u03bcm-es strukt\u00far\u00e1k)<\/li>\n<\/ul>\n
        \n

        M\u00e9rn\u00f6ki \u00e9rt\u00e9k<\/strong><\/span><\/h2>\n

        A zaf\u00edrb\u00f3l k\u00e9sz\u00fclt ideiglenes szil\u00edciumlapka-hordoz\u00f3 seg\u00edts\u00e9g\u00e9vel a fejlett csomagol\u00e1si technol\u00f3gi\u00e1kat alkalmaz\u00f3 gy\u00e1rt\u00f3k a k\u00f6vetkez\u0151ket \u00e9rhetik el:<\/p>\n

          \n
        • A szil\u00edciumlapok g\u00f6rb\u00fcl\u00e9s\u00e9nek \u00e9s deform\u00e1ci\u00f3j\u00e1nak jelent\u0151s cs\u00f6kken\u00e9se<\/li>\n
        • Jobb illeszt\u00e9si pontoss\u00e1g a s\u0171r\u0171 csomagol\u00e1sn\u00e1l<\/li>\n
        • Az ultrav\u00e9kony szil\u00edciumlapok (<50 \u03bcm) biztons\u00e1gos kezel\u00e9se<\/li>\n
        • A nagy fel\u00fclet\u0171 folyamatok sor\u00e1n a hozam nagyobb m\u00e9rt\u00e9k\u0171 \u00e1lland\u00f3s\u00e1ga<\/li>\n
        • A folyamat ism\u00e9telhet\u0151s\u00e9g\u00e9nek \u00e9s az \u00e1tbocs\u00e1t\u00e1si teljes\u00edtm\u00e9ny stabilit\u00e1s\u00e1nak jav\u00edt\u00e1sa<\/li>\n
        • Kompatibilit\u00e1s a k\u00f6vetkez\u0151 gener\u00e1ci\u00f3s heterog\u00e9n integr\u00e1ci\u00f3s platformokkal<\/li>\n<\/ul>\n
          \n

          GYIK<\/strong><\/span><\/h2>\n

          1. k\u00e9rd\u00e9s: Mi\u00e9rt haszn\u00e1lnak zaf\u00edrt az ideiglenes szil\u00edciumlapka-hordoz\u00f3khoz a fejlett csomagol\u00e1si technol\u00f3gi\u00e1kban?<\/strong>
          V: A zaf\u00edr kiv\u00e9teles merevs\u00e9get, kem\u00e9nys\u00e9get \u00e9s h\u0151stabilit\u00e1st biztos\u00edt, ami kiv\u00e1l\u00f3 torzul\u00e1scs\u00f6kkent\u00e9st \u00e9s mechanikai megb\u00edzhat\u00f3s\u00e1got tesz lehet\u0151v\u00e9 az ultrav\u00e9kony szil\u00edciumlapok feldolgoz\u00e1sa sor\u00e1n.<\/p>\n

          2. k\u00e9rd\u00e9s: T\u00e1mogatja-e a zaf\u00edr hordoz\u00f3 a l\u00e9zeres lev\u00e1laszt\u00e1st?<\/strong>
          V: Igen. Az UV\u2013k\u00f6z\u00e9p-infrav\u00f6r\u00f6s tartom\u00e1nyban el\u00e9rt magas optikai \u00e1tl\u00e1tsz\u00f3s\u00e1ga lehet\u0151v\u00e9 teszi a l\u00e9zer hat\u00e9kony \u00e1thatol\u00e1s\u00e1t, \u00edgy alkalmas l\u00e9zeres lev\u00e1laszt\u00e1si elj\u00e1r\u00e1sokhoz.<\/p>\n

          3. k\u00e9rd\u00e9s: Haszn\u00e1lhat\u00f3k-e a zaf\u00edr hordoz\u00f3k panel-szint\u0171 csomagol\u00e1si alkalmaz\u00e1sokhoz?<\/strong>
          V: Igen. A zaf\u00edr hordoz\u00f3k kiv\u00e1l\u00f3 s\u00edkfel\u00fcletet \u00e9s egyenletes fesz\u00fclts\u00e9geloszl\u00e1st biztos\u00edtanak a nagy fel\u00fclet\u0171 form\u00e1tumokhoz, \u00edgy alkalmasak az FOPLP \u00e9s m\u00e1s panel-szint\u0171 fejlett csomagol\u00e1si technol\u00f3gi\u00e1khoz.<\/p>","protected":false},"excerpt":{"rendered":"

          A zaf\u00edr ideiglenes szil\u00edciumlapka-hordoz\u00f3 egy fejlett m\u0171szaki hordoz\u00f3anyag, amelyet a k\u00f6vetkez\u0151 gener\u00e1ci\u00f3s f\u00e9lvezet\u0151-csomagol\u00e1s sor\u00e1n v\u00e9gzett ultrav\u00e9kony szil\u00edciumlapka-megmunk\u00e1l\u00e1shoz terveztek. Sz\u00e9les k\u00f6rben alkalmazz\u00e1k a 2,5D\/3D integr\u00e1lt \u00e1ramk\u00f6r\u00f6k integr\u00e1l\u00e1s\u00e1ban, a TSV- \u00e9s RDL-technol\u00f3gi\u00e1kban, a fan-out csomagol\u00e1sban, valamint egy\u00e9b olyan fejlett v\u00e9gs\u0151 f\u00e1zis\u00fa folyamatokban, amelyek ideiglenes szil\u00edciumlapka-t\u00e1maszt\u00e1st ig\u00e9nyelnek.<\/p>","protected":false},"featured_media":2996,"comment_status":"open","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"default","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center 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