{"id":3058,"date":"2026-06-10T03:45:55","date_gmt":"2026-06-10T03:45:55","guid":{"rendered":"https:\/\/www.fuyao-quartz.com\/?p=3058"},"modified":"2026-06-10T03:46:08","modified_gmt":"2026-06-10T03:46:08","slug":"fracture-mechanism-of-fused-silica-glass-wafers-during-double-sided-polishing-process","status":"publish","type":"post","link":"https:\/\/www.fuyao-quartz.com\/fr\/fracture-mechanism-of-fused-silica-glass-wafers-during-double-sided-polishing-process\/","title":{"rendered":"M\u00e9canisme de rupture des plaquettes de verre de silice fondue lors du processus de polissage double face"},"content":{"rendered":"<h2 class=\"wp-block-heading\">1. Introduction<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Le polissage double face (DSP) constitue l'\u00e9tape finale et la plus critique du traitement m\u00e9canique des plaquettes de verre de silice fondue. Il s'agit \u00e9galement de l'\u00e9tape la plus longue du processus et elle joue un r\u00f4le d\u00e9terminant dans la qualit\u00e9 finale du produit.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Au cours de ce processus, les d\u00e9fauts de surface courants comprennent les piq\u00fbres, les rayures, les \u00e9br\u00e9chures sur les bords, les fissures et la rupture compl\u00e8te de la plaquette. Parmi ceux-ci, les piq\u00fbres et les rayures peuvent souvent \u00eatre minimis\u00e9es, voire r\u00e9par\u00e9es, gr\u00e2ce \u00e0 l'optimisation des proc\u00e9d\u00e9s et au contr\u00f4le des conditions environnementales. En revanche, les \u00e9br\u00e9chures sur les bords, les fissures et la rupture sont des d\u00e9fauts irr\u00e9versibles qui entra\u00eenent directement le rejet de la plaquette.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Pour les plaquettes en silice fondue ultra-minces, les d\u00e9fauts li\u00e9s \u00e0 la rupture restent le principal obstacle \u00e0 l'obtention d'un rendement \u00e9lev\u00e9 et d'une production stable.<\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-large\"><img fetchpriority=\"high\" decoding=\"async\" width=\"1024\" height=\"430\" src=\"https:\/\/www.fuyao-quartz.com\/wp-content\/uploads\/2026\/06\/Fracture-Mechanism-of-Fused-Silica-Glass-Wafers-During-Double-Sided-Polishing-Process-1024x430.png\" alt=\"\" class=\"wp-image-3059\" srcset=\"https:\/\/www.fuyao-quartz.com\/wp-content\/uploads\/2026\/06\/Fracture-Mechanism-of-Fused-Silica-Glass-Wafers-During-Double-Sided-Polishing-Process-1024x430.png 1024w, https:\/\/www.fuyao-quartz.com\/wp-content\/uploads\/2026\/06\/Fracture-Mechanism-of-Fused-Silica-Glass-Wafers-During-Double-Sided-Polishing-Process-300x126.png 300w, https:\/\/www.fuyao-quartz.com\/wp-content\/uploads\/2026\/06\/Fracture-Mechanism-of-Fused-Silica-Glass-Wafers-During-Double-Sided-Polishing-Process-768x323.png 768w, https:\/\/www.fuyao-quartz.com\/wp-content\/uploads\/2026\/06\/Fracture-Mechanism-of-Fused-Silica-Glass-Wafers-During-Double-Sided-Polishing-Process-1536x645.png 1536w, https:\/\/www.fuyao-quartz.com\/wp-content\/uploads\/2026\/06\/Fracture-Mechanism-of-Fused-Silica-Glass-Wafers-During-Double-Sided-Polishing-Process-18x8.png 18w, https:\/\/www.fuyao-quartz.com\/wp-content\/uploads\/2026\/06\/Fracture-Mechanism-of-Fused-Silica-Glass-Wafers-During-Double-Sided-Polishing-Process-600x252.png 600w, https:\/\/www.fuyao-quartz.com\/wp-content\/uploads\/2026\/06\/Fracture-Mechanism-of-Fused-Silica-Glass-Wafers-During-Double-Sided-Polishing-Process.png 1699w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">2. Types de d\u00e9fauts de fracture<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">D\u00e9fauts de fracture dans <a href=\"https:\/\/www.fuyao-quartz.com\/fr\/product-category\/plaquette-de-quartz\/\">plaquettes de verre<\/a> comprennent g\u00e9n\u00e9ralement trois cat\u00e9gories :<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>\u00c9br\u00e9chure des ar\u00eates (rupture des ar\u00eates)<\/strong><br>G\u00e9n\u00e9ralement d\u00e9fini comme un endommagement visible des bords ou la pr\u00e9sence de fragments manquants d'une longueur sup\u00e9rieure \u00e0 0,3 mm.<\/li>\n\n\n\n<li><strong>Propagation des fissures<\/strong><br>Les fissures prennent souvent naissance au niveau des bords \u00e9br\u00e9ch\u00e9s et s'\u00e9tendent progressivement dans le corps de la plaquette.<\/li>\n\n\n\n<li><strong>Fracture compl\u00e8te (rupture)<\/strong><br>Si les fissures se propagent sous l'effet des contraintes lors des \u00e9tapes de traitement ou de manipulation ult\u00e9rieures, cela entra\u00eene une d\u00e9faillance catastrophique de la plaquette.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Dans la pratique industrielle, d\u00e8s qu'un \u00e9br\u00e9chage sur les bords est d\u00e9tect\u00e9, la plaquette est g\u00e9n\u00e9ralement class\u00e9e comme produit d\u00e9fectueux et retir\u00e9e du processus de fabrication, car elle pr\u00e9sente un risque \u00e9lev\u00e9 de d\u00e9faillance lors des \u00e9tapes suivantes.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">3. Origine de la fracture lors du polissage double face<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Au cours du processus DSP, la plaquette subit un mouvement complexe d\u00e9termin\u00e9 par :<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Rotation de la plaque sup\u00e9rieure<\/li>\n\n\n\n<li>Rotation de la plaque inf\u00e9rieure<\/li>\n\n\n\n<li>Rotation de l'engrenage solaire<\/li>\n\n\n\n<li>Mouvement du porte-roue (roue plan\u00e9taire)<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Dans ces conditions, la plaquette subit un mouvement combin\u00e9 de rotation et d'auto-rotation, ce qui rend l'analyse pr\u00e9cise des contraintes extr\u00eamement complexe.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Cependant, les statistiques de production r\u00e9v\u00e8lent une tendance claire : les d\u00e9fauts de rupture apparaissent presque toujours au niveau du bord de la plaquette. Cela indique que la r\u00e9sistance des bords de la plaquette est le facteur d\u00e9terminant qui r\u00e9git le comportement \u00e0 la rupture.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">4. La r\u00e9sistance des ar\u00eates : facteur cl\u00e9 de d\u00e9faillance<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">La r\u00e9sistance \u00e0 la rupture d'une plaquette de silice fondue d\u00e9pend principalement de la r\u00e9sistance de ses bords.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Afin d'am\u00e9liorer leur stabilit\u00e9 m\u00e9canique, les plaquettes sont g\u00e9n\u00e9ralement soumises \u00e0 <strong>chanfreinage des ar\u00eates (biseautage)<\/strong>, ce qui contribue \u00e0 r\u00e9duire la concentration des contraintes au niveau des bords. Un chanfrein correctement con\u00e7u am\u00e9liore consid\u00e9rablement la r\u00e9sistance \u00e0 la rupture.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Toutefois, m\u00eame avec une protection des ar\u00eates, des param\u00e8tres d'usinage inadapt\u00e9s ou une contrainte m\u00e9canique excessive peuvent encore entra\u00eener l'apparition d'une d\u00e9faillance au niveau de la zone chanfrein\u00e9e.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">5. Analyse des contraintes au niveau du bord de la plaquette<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Au cours du processus DSP, le bord de la plaquette est soumis \u00e0 une combinaison de forces :<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>F\u2081 : Force de pression verticale<\/strong><br>Principalement g\u00e9n\u00e9r\u00e9e par la pression de polissage exerc\u00e9e par la plaque sup\u00e9rieure.<\/li>\n\n\n\n<li><strong>F\u2082 : Force horizontale<\/strong><br>Principalement dus aux effets centrifuges lors de la rotation et \u00e0 la force de r\u00e9action exerc\u00e9e par le syst\u00e8me de support.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Au niveau du bord chanfrein\u00e9, ces forces peuvent \u00eatre d\u00e9compos\u00e9es comme suit :<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Forces normales perpendiculaires \u00e0 la surface du chanfrein<\/li>\n\n\n\n<li>Forces tangentielles parall\u00e8les \u00e0 la surface du chanfrein<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">L'\u00e9tat de contrainte combin\u00e9 peut \u00eatre exprim\u00e9 comme la superposition des \u00e9l\u00e9ments suivants :<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Contrainte normale (composantes de compression et de traction)<\/li>\n\n\n\n<li>Contrainte de cisaillement (composantes de glissement)<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Lorsque ces contraintes d\u00e9passent la limite de r\u00e9sistance m\u00e9canique de la silice fondue, des fissures apparaissent ; celles-ci commencent g\u00e9n\u00e9ralement au niveau du bord et se propagent vers l'int\u00e9rieur.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">6. M\u00e9canismes de d\u00e9faillance dans les plaquettes ultra-minces<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Pour les plaquettes en silice fondue ultra-minces (dont l'\u00e9paisseur est g\u00e9n\u00e9ralement inf\u00e9rieure \u00e0 0,3 mm), le risque de rupture augmente consid\u00e9rablement en raison de plusieurs facteurs :<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">6.1 Diminution de la r\u00e9sistance structurelle<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">\u00c0 mesure que l'\u00e9paisseur diminue, la rigidit\u00e9 m\u00e9canique globale de la plaquette est consid\u00e9rablement r\u00e9duite, ce qui la rend plus sensible aux contraintes externes.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">6.2 Zone de protection r\u00e9duite du chanfrein<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Les plaquettes ultra-minces pr\u00e9sentent un volume de chanfrein et une surface de contact nettement plus r\u00e9duits. De ce fait, l'effet protecteur du chanfreinage des bords s'en trouve affaibli.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">6.3 Augmentation de la concentration des contraintes<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Dans les m\u00eames conditions de polissage :<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>La surface de contact diminue<\/li>\n\n\n\n<li>La contrainte locale par unit\u00e9 de surface augmente<\/li>\n\n\n\n<li>La concentration des contraintes aux bords augmente consid\u00e9rablement<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Cela entra\u00eene une augmentation rapide des contraintes normales et de cisaillement au niveau du bord.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">7. Conclusion<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Les d\u00e9fauts de fracture observ\u00e9s sur les plaquettes de verre de silice fondue lors du polissage double face sont principalement dus \u00e0 des contraintes excessives au niveau du bord de la plaquette. Lorsque les contraintes normales et de cisaillement combin\u00e9es d\u00e9passent la limite de r\u00e9sistance m\u00e9canique du mat\u00e9riau, on assiste \u00e0 un \u00e9br\u00e9chage du bord, \u00e0 la propagation de fissures et, finalement, \u00e0 la rupture.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Les plaquettes ultra-minces sont particuli\u00e8rement vuln\u00e9rables en raison de leur faible \u00e9paisseur, de la protection r\u00e9duite de leurs bords et de la concentration accrue des contraintes.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Par cons\u00e9quent, pour am\u00e9liorer le rendement des plaquettes, il convient de mettre l'accent sur :<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Optimisation de la r\u00e9sistance des ar\u00eates<\/li>\n\n\n\n<li>Am\u00e9lioration de la conception des chanfreins<\/li>\n\n\n\n<li>R\u00e9gulation de la pression de polissage<\/li>\n\n\n\n<li>Optimisation de la vitesse de rotation<\/li>\n\n\n\n<li>Am\u00e9lioration de la stabilit\u00e9 du proc\u00e9d\u00e9<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">En ma\u00eetrisant soigneusement ces facteurs, il est possible de r\u00e9duire consid\u00e9rablement le risque de fracture, ce qui se traduit par un rendement plus \u00e9lev\u00e9 et une fiabilit\u00e9 de fabrication accrue dans la production de plaquettes en silice fondue.<\/p>","protected":false},"excerpt":{"rendered":"<p>1. Introduction Double-sided polishing (DSP) is the final and most critical step in the mechanical processing of fused silica glass wafers. It is also the longest processing stage and plays a decisive role in final product quality. During this process, common surface defects include pits, scratches, edge chipping, cracks, and complete wafer breakage. Among these, [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":3059,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[1],"tags":[1373,1366,1367,1370,506,1352,1379,1375,1376,1377,1350,1351,1372,1369,1368,1365,1371,1364,1378,1374],"class_list":["post-3058","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-industry-news","tag-chamfering-process","tag-double-sided-polishing","tag-dsp-process","tag-edge-chipping","tag-fused-silica-wafer","tag-glass-wafer","tag-microcrack-propagation","tag-normal-stress","tag-optical-glass-wafer","tag-precision-polishing","tag-quartz-wafer","tag-semiconductor-substrate","tag-shear-stress","tag-ultra-thin-wafer-processing","tag-wafer-breakage","tag-wafer-cracking","tag-wafer-edge-strength","tag-wafer-fracture-mechanism","tag-wafer-manufacturing-defects","tag-wafer-polishing-stress"],"_links":{"self":[{"href":"https:\/\/www.fuyao-quartz.com\/fr\/wp-json\/wp\/v2\/posts\/3058","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.fuyao-quartz.com\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.fuyao-quartz.com\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.fuyao-quartz.com\/fr\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.fuyao-quartz.com\/fr\/wp-json\/wp\/v2\/comments?post=3058"}],"version-history":[{"count":1,"href":"https:\/\/www.fuyao-quartz.com\/fr\/wp-json\/wp\/v2\/posts\/3058\/revisions"}],"predecessor-version":[{"id":3060,"href":"https:\/\/www.fuyao-quartz.com\/fr\/wp-json\/wp\/v2\/posts\/3058\/revisions\/3060"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.fuyao-quartz.com\/fr\/wp-json\/wp\/v2\/media\/3059"}],"wp:attachment":[{"href":"https:\/\/www.fuyao-quartz.com\/fr\/wp-json\/wp\/v2\/media?parent=3058"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.fuyao-quartz.com\/fr\/wp-json\/wp\/v2\/categories?post=3058"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.fuyao-quartz.com\/fr\/wp-json\/wp\/v2\/tags?post=3058"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}